Latest updates of VLSI technology nodes:
Latest updates of VLSI technology nodes: Here are the latest updates on VLSI nanometer technologies for Qualcomm, TSMC, Samsung, and Intel in 2024.
Qualcomm's Updates : Qualcomm has decided to partner with TSMC for its future chip manufacturing needs due to yield issues on Samsung's advanced process nodes, particularly the 4nm process node. This move will see Qualcomm's Snapdragon 8 Gen2 chipset produced on TSMC's 3nm process node.
TSMC's Updates : TSMC has started trial production of its 2nm chips and plans to begin mass production in 2025. Their 3nm-class manufacturing node has demonstrated comparable power performance and area to Intel's 18A node. TSMC's N3P technology is expected to arrive earlier on the market with better technology maturity and significant cost advantages.
Samsung's Updates : Samsung has committed to spending over $100 billion to improve its chip manufacturing arm but is currently experiencing yield issues on its advanced process nodes. Samsung's 3nm process node using GAAFETs was initially predicted for volume production by the end of 2021, but its more advanced 3GAP process is now expected in 2023. Samsung has begun trial production of its second-generation 3nm process, SF3 [3).
Intel's Updates : Intel has canceled its 20A process node for Arrow Lake and will instead use external nodes, likely from TSMC. Intel's 18A node is expected to be comparable to TSMC's N3P technology. Intel's RibbonFET transistor architecture is scheduled to enter product manufacturing phase in 2024 .
